يونيكوم X راي
آلة الفحص بالأشعة السينية ذات 7 محاور لإعادة البناء ثلاثية الأبعاد PCBA BGA AX9500 Unicomp
AX9500 UNICOMP 7-Axis 3D Reconstruction X-Ray Inspection Machine High-precision CT system for accurate PCB and BGA inspection with advanced 3D tomography capabilities. Advanced Inspection Capabilities CT detection for BGA, CSP, flip chips, LEDs and other semiconductors SMT welding analysis and ...
2D/2.5D/3D الكل في واحد التصوير 160kV أنبوب مفتوح أشباه الموصلات BGA AX9500 Unicomp ما بعد إعادة العمل PCBA QC الماسح الضوئي
AX9500 UNICOMP X-Ray Computed Tomography System High-precision 2D/2.5D/3D all-in-one imaging system for accurate PCB and BGA inspection with 160kV open tube technology. Advanced Inspection Capabilities Fully upgraded system capable of CT detection on BGA, CSP, flip chips, LEDs and other semiconducto...
آلة فحص التغليف بالأشعة السينية FPD SMT BGA عالية الوضوح AX9500 Unicomp
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...
Microfocus AX9100 CNC Mapping Unicomp X Ray 130kV للوحة الأم
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 44.7X Geometric magnification, high-definition real-time image. ● One-button operation with 2...
في الوقت الحقيقي Unicomp X Ray 1.2kW AX9100 لتجميع الإلكترونيات
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● ...
آلة الأشعة السينية لأنبوب التركيز الدقيق 7 ميكرومتر AX9100 لـ CSP EMS BGA
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1280(L)x1510(W)x1700(H)mm Weight 1750kg Power 220AC/50Hz Power Consumption 1.2kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 65W ...
آلة الفحص بأشعة X-ray ثلاثية الأبعاد ذات 7 محاور PCBA متعددة الأوضاع AX9500 Unicomp
Multi-mode 3D 7-axis PCBA X-ray Inspection Machine AX9500 Unicomp Fully upgraded new product capable of performing CT detection on BGA, CSP, flip chips, LEDs and other semiconductors. Also suitable for SMT welding analysis with 3D tomography CT scanning system (planar CT + cone beam CT). Application...
آلة الفحص بالأشعة السينية ذات الأنبوب المفتوح PCBA BGA بقدرة 160 كيلو فولت AX9500 Unicomp Head-In-Pillow
160kV Open Tube PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Head-In-Pillow High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other ...
Close Tube Unicomp X Ray AX9100 130 كيلو فولت لمكونات الإلكترونيات
130kV close tube X-ray Equipment AX9100 with high resolution FPD for electronics components couterfeit inspection Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum ...
