الالكترونيات X آلة راي
جهاز أحادي البؤرة الدقيقة X راي لفحص جودة خلية زر الليثيوم TWS
Unicomp microfocus X Ray Machine for TWS Lithium Button Cell Quality Check Features: ● 130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 47.7 Geometric X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming ...
تطبيق أشعة سينية ذات أنبوب مغلق 5 ميكرومتر لفحص خلية زر الليثيوم القابلة لإعادة الشحن للإلكترونيات القابلة للارتداء
Applying 5μm close tube X-ray to inspect Wearable Electronics rechargeable Lithium button cell Features: ● 130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 44.7X Geometric magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off...
آلة الأشعة السينية الصينية عالية الأداء Unicomp AX7900 لفحص المكونات الإلكترونية لثنائي الفينيل متعدد الكلور
High Performance X-Ray Machine Unicomp AX7900 for PCB Electronic Components Inspection The Unicomp AX7900 is a high-performance X-ray inspection system specifically designed for PCB electronic components, offering advanced imaging capabilities for quality control and failure analysis. Product ...
شاشة LCD مقاس 27 بوصة SMT EMS عيوب اللحام معدات الفحص الإلكترونية عالية الدقة
Application SMT, BGA, CSP, Flip Chip, LED Detection, Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV 7µm closed X-ray tube, high speed & Millions ...
Micro Focus Electronics X Ray System SMT Electronics التحكم في العيوب الداخلية
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area 645*670mm, max. inspection area ...
معدات BGA للفحص بالأشعة السينية مقاس 27 بوصة LCD مع وظيفة الكشف القابلة للبرمجة باستخدام الحاسب الآلي
Application Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection, Electronic components, Automotive parts, Photo-voltaic, Semiconductor, Packaging components, Battery Industry, Features Multi-function DXI image processing system, CNC ...
2.5D تمليك إلكترونيات X راي آلة 40W دوران 360 درجة مع 6 محور الحركة
Application SMT, BGA, CSP, Flip Chip, LED Detection, Ceramics, other special industries. Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Features Tilt detection with 55° and rotation 360°operation ...
عالية X نظام إلكترونيات X راي لفحص الفراغ بغا CSP / QFN / PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area 645*670mm, max. inspection area ...
التصنيع باستخدام الحاسب الآلي للكشف عن إلكترونيات X راي آلة لعبة غولف الكرة الداخلية فحص الجودة
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV 7µm closed X-ray tube, high speed & Millions ...
