الالكترونيات X آلة راي

AX9100 UNICOMP Optoelectronics Manufacturing Tester Advanced X-ray inspection system designed for internal packaging flaw detection in LED manufacturing and optoelectronics applications. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components Auto parts and Photovoltaic Industry Aluminum Die-casting and Moulding Plastic Ceramics and Other Special Industries Technical Specifications System

Full-angle Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 Advanced X-ray inspection system designed for precise geometric magnification and comprehensive chip production analysis with full-angle rotary detection capabilities. Applications SMT, BGA, CSP, Flip Chip, LED Detection Semiconductor and Packaging components Battery Industry and Electronic components Auto parts and Photovoltaic Industry Aluminum Die-casting and Moulding Plastic

7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with

CNC Auto Batch Inspection BGA Editmode X-ray AX9100 UNICOMP Electronics PCBA Processing Inspection System Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function

Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with

Lithium Battery X-ray Inspection Machine AX8300 The Unicomp AX8300 is a purpose-engineered offline micro-focus X-ray non-destructive testing system, specially optimized for high-precision quality control across PCBA, SMT assembly, semiconductor packaging and miniature electronic component manufacturing. Developed to fill the performance gap between mainstream 90kV and 130kV X-ray inspection equipment, it integrates Unicomp's proprietary self-developed 110kV sealed micro-focus

5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV

90KV Industrial X-ray Inspection Machine AX7900 for LED Lamp Bead Solder Void and Wire Breakage UNICOMP Product Overview The AX7900 industrial X-ray inspection system features a high-performance 90kV X-ray tube with 5μm ultra-high resolution and a high-sensitivity FPD flat-panel detector. Built with a multifunctional precision workstation, the system includes standard multi-axis XY motion and supports optional ±60° tilting movement for flexible multi-angle inspection.

110KV Industrial X-ray Inspection Machine for IGBT Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive