الالكترونيات X آلة راي

160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a maximum geometric magnification of 2000× with superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy

60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming

CX300 Unicomp Gold Bond Inspection Equipment 90kV 5μm Resolution Bonding Wire Semiconductor X-ray Tester for precise inspection and quality control. Applications BGA, CSP, LED, Flip Chip, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Aerospace Components, Photovoltaic Industry, and other specialized industries. Key Features Super Compact Desktop Design Multi-function X-Ray Inspection Multiple Inspection Modes Portable with Wheels Status

High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components. Key Features 130KV 7μm X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high

SMT electronics x ray machine sealed type X-ray Tube x-ray 110kv AX8300 X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X - Ray series) widely used in offline detection, defect analysis, used for PCBA, packaging, ceramics, plastics, LED, and so on. Major applications: PCBA BGA/IC LED Aliminum die casting Battery connector inspecting 1. Semiconductor package 2. Electronic connector module. 3

Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,

Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional

Deep Penetration Imaging Internal Porosity Defect Checking Die Casting X-ray AX9600 Unicomp The UNICOMP AX9600 high-power micro-focus X-ray inspection system delivers ultra-precision non-destructive testing for advanced semiconductor and electronic components, featuring deep penetration imaging for internal porosity and defect detection in die casting applications. Applications Specifically designed for high-end semiconductor and electronic component inspection, the AX9600

High Precision LED X-ray AX9600 Unicomp Optoelectronics Manufacturing Tester The UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components.