metal x ray machine
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آلة الأشعة السينية NDT عالية الدقة UNS160 للتعرف على العيوب الداخلية لأجزاء الصب الصغيرة
NDT UNS160 X Ray Equipment Applications of NDT X-ray Machine UNS 160-A : various types of metal castings hardware products plastic products refractory materials resin materials review conduct non-destructive testing on various small and micro products such as materials FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How about the
آلة الأشعة السينية الـ 160 كيلو فولت الـ UNICOMP لمحاكاة عيوب مسامية الشقوق
NDT UNS160 X Ray Equipment Applications of NDT X-ray Machine UNS 160-A : various types of metal castings hardware products plastic products refractory materials resin materials review conduct non-destructive testing on various small and micro products such as materials FAQ: 1. How about the package? Is it safe during the delivery? All X-ray inspection machine is packed with standard wooden solid carton. It is safe when shipping. 2. Do you provide the Warranty? How about the
آلة الأشعة السينية عالية الضخامة Unicomp AX7900 لمراقبة جودة الهواتف المحمولة المستعملة
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
CNC المبرمجة التفتيش التلقائي الإلكترونيات آلة الأشعة السينية Unicomp AX7900 مع زاوية الانحناء 60 درجة للتفتيش الهاتف المستخدم
CNC programable automatic inspection Electronics X-ray machine Unicomp AX7900 with tilting angle 60°for used phone inspection Description of IC X Ray machine AX7900: It is broadly utilized in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpoint
آلة أشعة سينية SMT PCB عالية الدقة Micron Focus Spot Size Unicomp AX7900 للهاتف الخلوي داخل الجودة والتفتيش على الشقوق
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
90KV ميكرون التركيز بقعة حجم أنبوب آلة الأشعة السينية يونيكومب المعدلة نموذج AX7900 مع أجهزة الكمبيوتر المزدوجة للتحقق من جودة الهاتف الخلوي
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
آلة الأشعة السينية 2D 2.5D عالية المواصفات لتحقيق الهواتف المحمولة وتحقق من الشقوق
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
جهاز أشعة سينية Unicomp AX9100max 220AC 50Hz لتسلق القصدير
Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconductor Battery Industry Small Metal Casting Electronic Connector Module Cables Photovoltaic Industry Application fields of Unicomp X-ray AX9100max Functions and Features Functions and
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application
