x ray detection systems
"
نظام الأشعة السينية Unicomp AX8200max مع أدوات قياس متعددة
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
AX8200max آلة إلكترونيات الأشعة السينية مع 6 محاور 360 درجة دوران اختياري
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
معدات فحص الأشعة السينية للأنابيب ذات حجم نقطة التركيز 5μm
X-Ray Inspection Equipment for Cable Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1220(D)×1615(H)mm Machine Weight 1250 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1250 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm Effective Detection Area 129*129mm Frame Rates 30fps
معدات فحص الأشعة السينية للأنابيب ذات التوتر القابل للتعديل من 0 إلى 90 كيلو فولت وزنها 1500 كيلوغرام
X-Ray Inspection Equipment for Switch Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1220(D)×1615(H)mm Machine Weight 1250 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1250 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm Effective Detection Area 129*129mm Frame Rates
آلة الأشعة السينية عالية الضخامة Unicomp AX7900 لمراقبة جودة الهواتف المحمولة المستعملة
High magnifications X-ray machine Unicomp AX7900 for used mobile phone quality inspection Description of IC X Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location Accurate Control, CNC Programming Automatic
CNC المبرمجة التفتيش التلقائي الإلكترونيات آلة الأشعة السينية Unicomp AX7900 مع زاوية الانحناء 60 درجة للتفتيش الهاتف المستخدم
CNC programable automatic inspection Electronics X-ray machine Unicomp AX7900 with tilting angle 60°for used phone inspection Description of IC X Ray machine AX7900: It is broadly utilized in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpoint
آلة أشعة سينية SMT PCB عالية الدقة Micron Focus Spot Size Unicomp AX7900 للهاتف الخلوي داخل الجودة والتفتيش على الشقوق
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray
90KV ميكرون التركيز بقعة حجم أنبوب آلة الأشعة السينية يونيكومب المعدلة نموذج AX7900 مع أجهزة الكمبيوتر المزدوجة للتحقق من جودة الهاتف الخلوي
90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection
آلة الأشعة السينية 2D 2.5D عالية المواصفات لتحقيق الهواتف المحمولة وتحقق من الشقوق
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
