industrial x ray systems
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آلة الأشعة السينية 2D 2.5D عالية المواصفات لتحقيق الهواتف المحمولة وتحقق من الشقوق
High specifications electronic boards 2D & 2.5D X-ray machine Unicomp AX7900 for used cellphone quality inspection and cracks checking Description of IC X Ray machine AX7900: It is widely used in various fields, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, small-scale metal casting, electronic connector modules, cables, aerospace components, as well as the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A
منطقة الكشف الفعالة 129x129mm معدات فحص الأشعة السينية للحلاقة الكهربائية 1280x1220x1615mm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization
الترقية إلى جهاز الكشف المسطح FPD معدات الفحص بالأشعة السينية لIC مع 1536 * 1536mm مصفوفة البكسل
X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few. FEATURES of IC Xray machine AX7900: Precision Positioning Laser Pointer System Installed on a Large Inspection Table Accurate Control, CNC
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)
Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis
Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application
عالية الكثافة المعادن الخلل X راي الكاشف معدات ونيكومب العامة 225KV
General 225KV High Density Metal Flaw X Ray Detector Equipment Unicomp Non Destructive Testing (NDT) is an important part of industrial quality management. Many Digital Radiography (DR) standards like the EN-17636 or NADCAP demand a high accuracy and reliable archiving of test-results. Unicomp has years long experience with many different applications and industries. As requirements vary between industries and even companies all systems can be easily customized and adapted.
اختراق قوي الوقت الحقيقي X راي المعدات معيار خط الانتاج مضمنة
Standard Inline Production Line NDT Real Time X Ray Inspection Equipment Features: * The implementation of automatic location detection * Automatic identification of defect detection * The unqualified product identification marking * OK and NG are sorting and recognition * High contrast, high quality image detection Applications: Aviation Construction Manufacturing Industrial Plants (Nuclear, Petrochemical, Power, Refineries, Fabrication Shops, etc. Pipelines Railways Food
المواد الخارجية للكشف عن المعادن X راي آلة ل صب العيوب
Casting Defects Foreign Material Metal X Ray Detection Machine in Uzbekistan Unicomp Technology automated x-ray systems inspect steel or aluminum alloy castings expressly for the automotive industry. The automated radioscopic inspection of aluminum die castings can be performed for an audit-based or production-level scale. Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for medium•large size
سلامة الأغذية الفاكهة التلقائي X راي أنظمة التفتيش 40-120kV للكشف عن إبرة
Food Safety Automatic X-ray Inspection Systems for Unpackaged Products Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
