bga x ray inspection system
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آلة الأشعة السينية Unicomp AX7900 لـ EMS SMT PCBA BGA QFN CSP
CE FDA compliance x ray machine Unicomp AX7900 for EMS SMT PCBA BGA QFN CSP soldering Void checking Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
نظام التحليل بالأشعة السينية Unicomp AX9100vs متعدد الأوضاع 3D Micro-focus
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
Unicomp AX8300VS نظام تفتيش متعدد الأوضاع 3D ميكرو تركيز الأشعة السينية
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
تجميع لوحة الدوائر المطبوعة عالية الدقة ذات الفتحات عبر الثقوب بالأشعة السينية AX7900 Unicomp عالية الثبات
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
آلة التصوير الإشعاعي الرقمي و آلة الأشعة السينية Unicomp AX7900 لإصلاح الجهاز المحمول و IC/ BGA لقياس اختبار الحرار بالكرة
Digital Radiography machine & x ray machine Unicomp AX7900 for pcb repair and IC/BGA ball soldering measurement&testing Description of IC X Ray machine AX7900: It is widely adopted across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics. FEATURES of IC Xray machine AX7900: Large Size Inspection Table
90kv آلة الأشعة السينية عالية الدقة Unicomp AX7900 مع أنبوب 5um لاختبار انحناء أسلاك BGA
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
جهاز الأشعة السينية عالي الدقة AX8200MAX لفحص العيوب الداخلية بشريحة Semicon
High Resolution X-Ray machine AX8200MAX for Semicon Chip inner defects inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming Automatic
China Unicomp 90KV X-ray مع نظام فحص HD PFD للكشف عن عيوب مجموعة الشرائح
China Unicomp 90KV X-ray with HD PFD Inspection System for Chipset Defects Detecting Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control, CNC Programming
آلة الأشعة السينية عالية الدقة في الوقت الحقيقي 90kv Unicomp AX7900 لمراقبة جودة PCBA
90kv real-time high precision X ray machine Unicomp AX7900 for PCBA quality control Description of IC X Ray machine AX7900: It is extensively used in various industries, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor production, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, as well as Photovoltaics. FEATURES of IC Xray machine AX7900: Laser Pinpoint for Precise Location on Large-Scale Inspection Tables
