x ray inspection system
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آلة الأشعة السينية من 130KV Micron Focus Spot Size Tube AX9100MAX مع أجهزة كمبيوتر مزدوجة للفحص PCB&BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
آلة الأشعة السينية PCB عالية الضخامة Unicomp AX9100MAX لمكونات الإلكترونيات IC فحص الأسلاك اللاصقة
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4 kW X-Ray Tube Tube Type Type Sealed type
آلة الأشعة السينية 130KV Micron Focus Spot Size Tube Unicomp AX9100 النموذج المحسن AX9100MAX مع أجهزة الكمبيوتر المزدوجة للفحص PCB&BGA
It is widely applied in numerous fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, to name a few. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 4
لوحات إلكترونية عالية المواصفات 2D و 2.5D آلة الأشعة السينية Unicomp AX9100MAX مع طاولة دوران 360 درجة للفحص BGA و PCB
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
450KV الصلب الأنابيب اسطوانة الصناعية X راي آلة يونيكومب الحديد الدكتايل UNC450
450KV Steel Pipe Cylinder Industrial X Ray Machine Unicomp Ductile Iron UNC450 It is widely applied to inspect all kind of casting,NDT for air bubble,porosity and unwanted foreign.The equipment is applicable objects for NDT of cylinder welding defects and body,sidewall,lap,Crown steel cord and steel belt of tyre slag inclusion,crack,loosen and other flaws in hubs,pressure vessel,refractory material,bullet,boilr welded pipe and screwy pipe. Applications: Aerospace Automotive
آلة الأشعة السينية PCB عالية الضخامة Unicomp AX9100MAX لمكونات الإلكترونيات IC فحص الأسلاك اللاصقة
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
حجم بقعة التركيز الميكرونية لجهاز SMT PCB الأشعة السينية لقياس فراغات BGA وتفتيش ارتفاع الصعود السابق لللحام
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
آلة أشعة سينية SMT PCB Unicomp AX9100MAX ذو الدقة العالية حجم بقعة التركيز الميكرونية لفحص الفراغات BGA وعماد اللحام
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption
آلة الأشعة السينية Unicomp AX9100max 130kV 65W للتفتيش IGBT
Unicomp AX9100max X-ray Machine For IGBT The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
