real time x ray system
"
5um X راي قابلة للبرمجة باستخدام الحاسب الآلي معدات 90kV لموصل الكابل
Factory manufacturer of 90kV closed tube 5 um high resolution X-ray equipment for electronics Cable connector harness broken crack twrist quality inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD
أنبوب مختوم Unicomp X Ray Interactive Touch 90kV Benchtop للإبرة الساكنة
Unicomp Factory directly supply of 90kV X-ray machineto find medical indwelling needle inside crack defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
أنبوب مختوم Unicomp X Ray LCD AX8200MAX 1.0kW فحص الإبرة الساكنة الوريدية
Discovering how the Unicomp AX8200Max X-ray machine to inspect medical venous indwelling needle qualtiy issue Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
Microfocus 2.5D Unicomp X Ray AX8200 Max 5um 6 Axis Manipulator للإلكترونيات
Unicomp AX8200Max 5um microfocus 2.5D X Ray Machine with 6 Axis Manipulator For Automotive electronics quality checking Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3.
Close Tube Unicomp X Ray AX8200 Max 5μM لإلكترونيات السيارات
Using Unicomp AX8200Max close tube Microfocus X-ray to detect Automotive electronics inner quality defects Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate Control,
Unicomp AX8200MAX 2.5D X راي آلة قياس السيارات ل PCBA BGA QFN
Unicomp AX8200MAX 2.5D X-ray machine for PCBA BGA QFN soldering voids Auto measurement Application Fields of AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive Touch LCD Display 3. Accurate
لحام تسخير الأسلاك BGA X Ray آلة فحص التركيز الدقيق 2.5D AX8200MAX
Wire Harness Welding Quality Inspection by 2.5D micro focus X Ray Machine AX8200MAX Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive
آلة التفتيش Unicomp AX8200max X Ray لفحص عيوب تسخير الأسلاك
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC
نظام الأشعة السينية Unicomp AX8200max مع أدوات قياس متعددة
Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector