real time x ray system
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دقة حركة عالية 5 ميكرومتر تركيز دقيق معدات الأشعة السينية للإلكترونيات BGA QFN AX7900 لمراقبة الجودة من Unicomp
High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option
مجموعة شرائح فحص الجودة الداخلية بإطار من Unicomp 5um أنبوب مغلق AX7900 X Ray
Chipset Lead frame Inner Quality Inspection by Unicomp 5um closed tube AX7900 X Ray Machine Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area 420mm
توريد مصنع Unicomp من 90KV microfocus 2.5D نظام الفحص بالأشعة السينية لفحص العيوب الداخلية للرقاقة
Unicomp factory supply of 90KV microfocus 2.5D X-ray Inspection System for Chip Inner Defect Inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading
Unicomp AX7900 90kV آلة فحص الأشعة السينية لفحص SMT BGA لفحص جودة IC الفراغ
Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
1.6kW Offline Programming Unicomp X Ray AX9100 للموصل
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Microfocus AX9100 CNC Mapping Unicomp X Ray 130kV للوحة الأم
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
3um أنبوب مغلق 1.6kW آلة راي لـ SMT BGA CSP
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,
نظام فحص الأشعة السينية FPD 90KV معتمد من قبل CE / FDA للكشف عن عيوب المكثفات
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Unicomp 320kV معدات التصوير الشعاعي X راي CE لصب الألومنيوم
Dynamic Precise Casting Part Inspection Real Time X-ray Image System The UNC320 is the newest standard system. Whether you are inspecting small or large components, the UNC320 is the best option for customers needing a compact system with unique capabilities generally available on a larger X-ray or CT system. SYSTEM CAPABILITIES Advanced 2D X-ray inspection Overall Maximum System Resolution: ~5 microns 50cm diameter x 80cm tall nominal part envelope Comprehensive acquisition,
