pcb x ray inspection
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آلة التفتيش Unicomp AX8200max X Ray لفحص عيوب تسخير الأسلاك
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace ...
360 درجة دوران CNC التلقائي MOSFET PCB الجمعية نظام التفتيش بالأشعة السينية AX8300MAX Unicomp أداء مستقر
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ...
Unicomp AX8200 مع جهاز FPD 100kv Pcb X Ray لاختبار جودة PCBA
Unicomp AX8200 automated smt pcb xray machine for computer motherboard repair The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...
آلة الأشعة السينية PCB عالية الضخامة Unicomp AX9100MAX لمكونات الإلكترونيات IC فحص الأسلاك اللاصقة
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
حجم بقعة التركيز الميكرونية لجهاز SMT PCB الأشعة السينية لقياس فراغات BGA وتفتيش ارتفاع الصعود السابق لللحام
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine ...
آلة أشعة سينية SMT PCB Unicomp AX9100MAX ذو الدقة العالية حجم بقعة التركيز الميكرونية لفحص الفراغات BGA وعماد اللحام
It finds extensive use in various fields including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Modules, Cables, and Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary ...
100kV PCBA X راي نظام التفتيش Unicomp إلكترونيات لـ BGA Void / Soldering
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification ...
آلة فحص FDA 0.8KW X Ray FPD لبطارية الليثيوم
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This ...
مكثف عيب داخلي إلكترونيات BGA X Ray نظام فحص السيارات قياس
Capacitor Inner Defect Inspection with Electronics X-ray 100 KV Power AX8200MAX Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, ...
