industrial x ray systems
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(يونيكومب) UNC320 الأشعة السينية تحدد العيوب في مكونات الطيران
Unicomp UNC320 X-Ray Identifies Flaws in Aerospace Die Cast Components Product Description: Primarily aimed at non-destructive testing applications, this technique is widely used in a range of products including metal castings, hardware components, plastic items, refractory materials, resin-based materials, composites, ceramic bodies, and various welded metal parts, among others. It guarantees the quality and integrity of these materials and components without causing any
UNC320 UNICOMP NDT معدات الأشعة السينية للكشف عن العيوب الداخلية في صب الطائرات والفضاء
Detect Internal Defects in Aerospace Castings with Unicomp UNC320 X-Ray Product Description: Focused primarily on non-destructive testing, this technique is extensively applied to a variety of products such as metal castings, hardware components, plastic products, refractory materials, resin materials, composites, ceramics, and numerous welded metal parts, among others. It ensures the quality and soundness of these materials and components without inflicting any damage or
UNC320 جهاز فحص بالأشعة السينية للفحص في صب الصب الصناعي الفضائي العيوب الخفية
Unicomp UNC320 X-Ray Inspecting Aerospace Die Castings for Hidden Defects Product Description: Centered mainly on non-destructive testing, this methodology is widely utilized across a diverse range of products, including metal castings, hardware parts, plastic items, refractory materials, resin-based materials, composites, ceramics, and various welded metal components, among others. It guarantees the quality and reliability of these materials and components without causing
225 كيلو فولت الجهد Unicomp UNC320 الأشعة السينية للكشف عن العيوب الداخلية في دعامات السيارات 7500kg وزن الجهاز
Unicomp UNC320 X-Ray for detecting internal defects in Car Bracket Product Description: This technique, which primarily focuses on non-destructive testing, is widely employed for a diverse range of products, including metal castings, hardware components, plastic items, refractory materials, resin materials, composites, ceramics, and various welded metal parts, among others. It guarantees the quality and integrity of these materials and components without causing any harm or
الكشف عن العيوب الداخلية في دعامة السيارة مع UNC320 Unicomp الأشعة السينية
Detect Internal Flaws in Car Bracket with Unicomp UNC320 X-Ray Product Description: This non-destructive testing technique is broadly applied to a variety of products, such as metal castings, hardware parts, plastic goods, refractory substances, resin materials, composites, ceramics, and multiple welded metal components, among others. It ensures the quality and structural integrity of these materials and components without inflicting any damage or modifying their original
جهاز الأشعة السينية Unicomp AX9180 180kV Microfocus Electronics مع FPD مائل
Unicomp AX9180: أشعة سينية ذات تركيز دقيق 180 كيلو فولت مع حجم موضعي 10 ميكرومتر، وإمالة 60 درجة، ووصلة ذات 7 محاور. توفر FPD عالية الدقة تكبيرًا بمقدار 1000X لإجراء فحص دقيق لثنائي الفينيل متعدد الكلور وBGA وأشباه الموصلات. يتضمن ضمانًا لمدة عام وبرمجة دون اتصال بالإنترنت.
دقة حركة عالية 5 ميكرومتر تركيز دقيق معدات الأشعة السينية للإلكترونيات BGA QFN AX7900 لمراقبة الجودة من Unicomp
High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option
CX3000 إلكترونيات فبا يونيكومب X راي كشف آلة، بينشتوب X راي آلة
CX3000 Benchtop Electronics PCBA Unicomp X-ray Detection Equipment Features: 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with high-resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area easily positioned by external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock and emergency button. Applications: BGA , CSP , LED , Flip Chip , Semiconducto
عالية الطاقة الأشعة السينية معدات الكشف إلكترونيات سمت بغا أشباه الموصلات
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
