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جودة Unicomp LX9200 3D CT X Ray آلة التصوير المقطعي المحوسبة 130KV مضمن لفحص PCB BGA مصنع

Unicomp LX9200 3D CT X Ray آلة التصوير المقطعي المحوسبة 130KV مضمن لفحص PCB BGA

Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge...

جودة عالية X نظام إلكترونيات X راي لفحص الفراغ بغا CSP / QFN / PoP مصنع

عالية X نظام إلكترونيات X راي لفحص الفراغ بغا CSP / QFN / PoP

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing

جودة 220VAC CNC للإلكترونيات القابلة للبرمجة X راي آلة 5um 90kV AX8200 مصنع

220VAC CNC للإلكترونيات القابلة للبرمجة X راي آلة 5um 90kV AX8200

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection Item Definition Specs System Parameters Size 1080(L

جودة آلة فحص FPD 130kV X Ray لسخان الخرطوشة مصنع

آلة فحص FPD 130kV X Ray لسخان الخرطوشة

Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point

جودة التصنيع باستخدام الحاسب الآلي للكشف عن إلكترونيات X راي آلة لعبة غولف الكرة الداخلية فحص الجودة مصنع

التصنيع باستخدام الحاسب الآلي للكشف عن إلكترونيات X راي آلة لعبة غولف الكرة الداخلية فحص الجودة

Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and

جودة دقة حركة عالية 5 ميكرومتر تركيز دقيق معدات الأشعة السينية للإلكترونيات BGA QFN AX7900 لمراقبة الجودة من Unicomp مصنع

دقة حركة عالية 5 ميكرومتر تركيز دقيق معدات الأشعة السينية للإلكترونيات BGA QFN AX7900 لمراقبة الجودة من Unicomp

High Motion Precision 5μm Micro Focus BGA QFN Electronics X-ray Equipment AX7900 Automatic X-ray Mapping Inspection for IC Electronics Components Advanced X-ray inspection system for internal quality assessment and counterfeit detection of electronic components. System Overview The AX7900 features a 90KV 5μm X-ray tube with FPD detector, multi-function workstation, and comprehensive motion control system. The system includes XY multi-axis movement with ±60° tilt motion option

جودة BGA QFN CSP X Ray Equipment LX2000 CNC قابلة للبرمجة لحام FPC SMT مصنع

BGA QFN CSP X Ray Equipment LX2000 CNC قابلة للبرمجة لحام FPC SMT

LX2000 inline x-ray equipment with CNC programmable inspection for FPC SMT soldering process of BGA , QFN, CSP parts Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed

جودة EMS BGA 90kV 5um NDT X Ray معدات FPD لتسخير موصل الكابل مصنع

EMS BGA 90kV 5um NDT X Ray معدات FPD لتسخير موصل الكابل

Real Time close tube 90kV 5um X-ray Equipment with FPD for Wire Harness cable connector inner quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max

جودة 5um SMT X Ray معدات CNC قابلة للبرمجة لفراغات EMS BGA مصنع

5um SMT X Ray معدات CNC قابلة للبرمجة لفراغات EMS BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)