x ray imaging system
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نظام فحص الإمالة المحسن عالي الدقة لمكونات MOSFET نظام فحص الأشعة السينية AX8300 Unicomp أداء مستقر
Enhanced Tilt Inspection High Precision MOSFET Component Xray Inspection System AX8300 Unicomp Stable Performance The AX8300 X-ray inspection system is extensively deployed for circuit board and semiconductor inspection. As an offline X-ray solution, it is widely adopted in offline testing and defect analysis, ideal for PCBA, semiconductor packaging, ceramics, plastics, LED components and other precision electronic parts. System Summary Dimension 1215(W)∗1325(D)∗1700(H)mm
متعدد المناور 160KV التصوير الإشعاعي DR آلة الأشعة السينية NDT لأجزاء صب الألوميموم الصغيرة فحص مسامية الكراك
Multi-manipulator 160KV Radiography DR X-ray NDT Machine for small alumimum Casting Parts crack porosity checking Technical Data of UNC160s Attribute Respective Value Sample Dimensions Outer width: 250 [mm] max. Outer diameter: 550 [mm] max. Maximum Sample Weight 15 [kg] System Dimension 1480mm*1106mm*2038mm(L*W*H) X-ray Tube 160 [kV] Detector Active Area 250*550mm Pixel Pitch 139 [m] Maximum penetration(AL) 100mm/20mm Detector Resolution 3.1LP/mm Our goal is to solve
أجهزة الفحص بالأشعة السينية لشركة Unicomp AX8300 Plus
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
آلة فحص الأشعة السينية للأغذية للتحقق من المواد الغريبة داخل الأغذية المعبأة الجافة
X-Ray detection equipment for dry pack food inspection with auto rejector Applications of Food Xray UNX4015-N UNX4015-N is used to detect foreign matter contaminants in small bags for lightweights products. Such as candy, fresh meat, prawn, vegetable, poultry, chocolates, candy, pasta, instant noodles, bread, biscuits, dried fish, ham sausage, beef jerky, nuts, etc. Features of Food Xray Easy to Operate: one button start & stop, optional default product Provide High precision
نظام الأشعة السينية Unicomp AX7900 90KV 2D للكشف الدقيق عن الفراغات BGA
Unicomp AX7900 90KV 2D X-ray System for Accurate BGA Void Detection Description of BGA X-Ray machine AX7900: Equipped with 90kV / 5μm micro-focus X-ray tube and high-performance FPD detector, AX7900 adopts a multifunctional workstation design. It features standard XY multi-axis motion with optional ±60° tilt. Independent Z-axis movement of X-ray tube and FPD allows flexible adjustment of magnification and FOV. Integrated with target positioning system and professional DXI
تجميع لوحة الدوائر المطبوعة عالية الدقة ذات الفتحات عبر الثقوب بالأشعة السينية AX7900 Unicomp عالية الثبات
X-Ray Inspection Equipment AX7900 UNICOMP AX7900 is a professional high-resolution micro-focus X-ray NDT testing machine for SMT production, semiconductor packaging and new energy battery quality inspection. Built with proprietary self-developed X-ray source and high-sensitivity digital imaging detector, it clearly visualizes invisible internal defects of electronic devices. It precisely detects BGA solder voids, interlayer separation of PCB boards, chip bonding defects,
مسح التصوير BGA كشف الفراغ PCBA BGA الأشعة السينية AX9600 Unicomp SMT PCB نظام التفتيش الجمعية
Clear Imaging BGA Void Detection PCBA BGA X-ray AX9600 Unicomp SMT PCB Assembly Inspection System UNICOMP AX9600 adopts an in-house developed 160kV high-power open micro-focus X-ray tube with an ultra-fine 0.8μm focal spot. It supports magnification up to 2000× and offers superior X-ray penetration, enabling precise void content measurement for TVS diodes. Optimized for high-end semiconductor inspection, it caters to high-precision quality control of advanced IC packaging,
منتج الكهرباء مع جهاز الأشعة السينية Unicomp UNC160
Electricity product with Unicomp UNC160 X-Ray device Product Description: It is mainly applied for non-destructive examination of a wide range of products, including metal castings, hardware components, plastic items, refractory substances, composite materials, ceramic structures, and welded metal sections. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety
UNC160 نظام الأشعة السينية لمراقبة الكهرباء
Unicomp UNC160 X-Ray System for electricity Inspection Product Description: Primarily used for inspecting various products, including metal castings, hardware items, plastic products, refractory materials, composite materials, ceramic bodies, and welded metal parts, without causing damage. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety set up Image
