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x ray detection systems

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جودة معدات التصوير الشعاعي NDT Unicomp X Ray لاختبار شقوق لحام الأنابيب مصنع

معدات التصوير الشعاعي NDT Unicomp X Ray لاختبار شقوق لحام الأنابيب

Unicomp Riadiography NDT X-Ray inspection systems for pipes welding crack testing Applications: ● Cast parts and pressure Vessels ● Steel pipe,Cylinder and Wood ● Epoxy Resin Defect Detection ● Wheel,Tires and Metal parts Features: ● Strong penetration,high reliable,low breakdown, long life; ● High definition,resolution FPD; ● High automation,fast detection speed; ● User friendly software design for interfacing and to facilitate,customize software function development

جودة 1.6kW Offline Programming Unicomp X Ray AX9100 للموصل مصنع

1.6kW Offline Programming Unicomp X Ray AX9100 للموصل

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Offline programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

جودة Microfocus AX9100 CNC Mapping Unicomp X Ray 130kV للوحة الأم مصنع

Microfocus AX9100 CNC Mapping Unicomp X Ray 130kV للوحة الأم

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

جودة 3um أنبوب مغلق 1.6kW آلة راي لـ SMT BGA CSP مصنع

3um أنبوب مغلق 1.6kW آلة راي لـ SMT BGA CSP

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor,

جودة Microfocus أنبوب مغلق Unicomp X Ray 130kV 3um لحام SMT BGA مصنع

Microfocus أنبوب مغلق Unicomp X Ray 130kV 3um لحام SMT BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati

جودة نظام الفحص Unicomp Microfocus X Ray 130kV 3um لصورة FPD مصنع

نظام الفحص Unicomp Microfocus X Ray 130kV 3um لصورة FPD

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

جودة Real Time Unicomp X Ray 1.6kW AX9100 لتجميع الإلكترونيات مصنع

Real Time Unicomp X Ray 1.6kW AX9100 لتجميع الإلكترونيات

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power

جودة نظام فحص BGA QFN Unicomp X Ray 130KV مع حركة 6 محاور مصنع

نظام فحص BGA QFN Unicomp X Ray 130KV مع حركة 6 محاور

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

جودة 3µM Microfocus Tube X Ray Machine AX9100 لـ CSP EMS BGA مصنع

3µM Microfocus Tube X Ray Machine AX9100 لـ CSP EMS BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage