security x ray machine
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آلة فحص الأشعة السينية الإلكترونية AX7900 Unicomp 5μm Micro Focus Auto Void Detection BGA Solder دقة عالية
Electronic Semiconductor X-Ray Inspection Equipment AX7900 The UNICOMP AX7900 is a high-precision micro-focus X-ray inspection instrument launched by UNICOMP Technology. It focuses on non-destructive testing in electronic manufacturing and semiconductor fields. Integrated with self-developed core components and intelligent control system, it supports diversified inspection scenarios such as BGA, CSP, Flip Chip, LED, PCB, batteries and small metal castings. With excellent
0.8kW BGA باطل قياس X راي آلة للهاتف المحمول PCBA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Technical Data System SummaryFootprint1080(W)×1180(D)×1730(H)mmMachine Weight1050 kgPower SupplyAC 110~220V, 50/60HzPlywood Packing Size146(W)×128(D)×196(H)cmPacking Weight1160 kgPower Consumption1.0 kWX-Ray TubeTube TypeSealedMax. Power8WVoltage0~90kV (Adjustable)Focus Spot Size5μmImaging SystemDetectorFlat Panel Detector (option 4’’ i.i. Detector)Pixel Size85μmEffective Detection Area130*130mmFrame Rates20fpsPi
متعددة الوظائف DR CT التصوير المزدوج الأشعة السينية الصناعية CT UNCT3500 Unicomp اختبار غير مدمر
Multi-function DR CT Dual Imaging Industrial X-ray CT UNCT3500 Unicomp Non-Destructive Testing Detection purpose: Adaptable to a wide range of sizes and materials, this system meets the diverse industrial CT application requirements of various sectors. It is primarily utilized for the precision inspection of medium-to-large-scale products, including metal castings and non-ferrous metals, lithium-ion new energy battery modules, non-metallic workpieces, and composite materials.
في خط أسطواني بطارية ليثيوم X راي مع تصميم السلامة الموجهة
In-line Cylindrical Lithium Battery X-ray Detector with Safety-oriented design The lithium battery X-Ray detection equipment of multiple types and full automation solely-developed by Unicomp Technology is targetted to inspect cells alignment metric and tabs soldering quality . It improves automation as well as gains high-definition internal images by means of X-ray imaging technology . This technology is widely applied to the detection of lithium battery in various types
دقة عالية للغاية، فحص دقيق لفراغ اللحام PCBA MOS Chip X-ray AX9600 Unicomp Power Component PCB
Ultra High Resolution Accurate Solder Void Inspection PCBA MOS Chip X-ray AX9600 Unicomp Power Component PCB Unicomp Equipped with UNICOMP’s independently developed 160kV high-power open micro-focus X-ray tube, the AX9600 achieves an ultra-fine focal spot of 0.8μm. Combined with 2000× ultra-high optical magnification and superior X-ray penetration performance, it enables high-accuracy void fraction testing for TVS diodes. It is specially optimized for high-precision non
آلة الأشعة السينية UNC225 لشركة يونيكومب تحدد العيوب في الراتنج الكهربائي بحجم محور 0.4mm/1.0mm عند 225kV
Unicomp UNC225 X-Ray Identifies Flaws in Power resin Mainly used in metal castings, hardware products, plastic products, refractory materials, resin materials, composite materials, ceramic body and welding metal parts and other small products for non-destructive testing. Functional Characteristics 1. Wide range of applications to meet the inspection of multiple sizes and types of products. Low failure rate, best-selling equipment for 9 years 2. Safety: High level protection,
Unicomp AX8300MAX 110KV الفحص بالأشعة السينية للتشققات الداخلية في مكونات السيراميك
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
فحص الأشعة السينية Unicomp 110KV للكشف عن الفراغات MOSFET وتحليل الموثوقية AX8300MAX
Unicomp AX8300MAX 110KV X-ray Inspection for Internal Cracks in Ceramic Components Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task
Unicomp AX9600 160KV أنبوب مفتوح 2.5D أشعة سينية للديودات الداخلية TVS عالية الدقة
Unicomp High-end Semiconductor X-Ray Inspection System AX9600 UNICOMP AX9600 features a self-developed 160kV high-power open micro-focus X-ray tube, delivering an ultra-small 0.8μm focal spot. With exceptional magnification up to 2000 times and outstanding ray penetration capacity, it accurately measures void ratio of TVS diodes, and is ideal for high-precision quality inspection of advanced IC packaging, HBM memory chips and GPU semiconductor components. Specifications:
