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جودة آلة أشباه الموصلات 110 كيلو فولت للإلكترونيات X راي 5um AX8500 لـ PCBA BGA مصنع

آلة أشباه الموصلات 110 كيلو فولت للإلكترونيات X راي 5um AX8500 لـ PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

جودة SMT PCBA Electronics X Ray Chip Counter Unicomp CX7000L 440mm نفق مصنع

SMT PCBA Electronics X Ray Chip Counter Unicomp CX7000L 440mm نفق

Factory directly supply of SMD Xray Chip counter Unicomp CX7000L for SMT and PCBA electronics compamy Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System

جودة CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 لـ SMT PCBA BGA QFN مصنع

CSP SMT Electronics X Ray Machine 110kV Unicomp AX8500 لـ SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

جودة SMT BGA Electronics X Ray Machine FPD 1000X Magnification Unicomp AX8500 مصنع

SMT BGA Electronics X Ray Machine FPD 1000X Magnification Unicomp AX8500

Unicomp AX8500 X Ray with FPD Detector and 1000X Magnification to check Semiconductor components quality issue Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel

جودة CNC المبرمجة التفتيش التلقائي الإلكترونيات آلة الأشعة السينية Unicomp AX7900 مع زاوية الانحناء 60 درجة للتفتيش الهاتف المستخدم مصنع

CNC المبرمجة التفتيش التلقائي الإلكترونيات آلة الأشعة السينية Unicomp AX7900 مع زاوية الانحناء 60 درجة للتفتيش الهاتف المستخدم

CNC programable automatic inspection Electronics X-ray machine Unicomp AX7900 with tilting angle 60°for used phone inspection Description of IC X Ray machine AX7900: It is broadly utilized in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpoint

جودة سمت معدات الالكترونيات X راي آلة، بب نظام التفتيش مايكرو بغا على تحليل ختم مصنع

سمت معدات الالكترونيات X راي آلة، بب نظام التفتيش مايكرو بغا على تحليل ختم

PCB X Ray Machine high quality PCB inspection system Micro BGA on chop analysis Our unicomp X-Ray Inspection System is a full featured high-performance x-ray inspection system with an unbeatable price to performance ratio and includes all of the advanced features you would expect to find on a much more expensive x-ray inspection system. X-ray inspection system has been widely applied to Circuit Board Inspection,Semi-Conductor Inspection and Other Applications. (Offline X -

جودة Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array مصنع

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application fields

جودة PCBA 22 "LCD 1kW NDT Electronics X Ray Machine مصنع

PCBA 22 "LCD 1kW NDT Electronics X Ray Machine

Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function workstation with

جودة مختومة في الوقت الحقيقي متعددة الوظائف للإلكترونيات مكثف X راي آلة مصنع

مختومة في الوقت الحقيقي متعددة الوظائف للإلكترونيات مكثف X راي آلة

Real Time Multi - Function Electronics X Ray Machine For Capacitor Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 24’’ FHD Interactive Touch LCD Display Large Size Inspection Table Laser Locator for Precise Location Fingerprint Access Management System Real-time Monitoring of