electronics x ray system
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Fully automatic SMD X Ray Chip Counter for all range of reel, JEDEC Tray and tube parts with ERP MES connection Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating
Unicomp SMD Chip Counter X Ray رباعي بكرة وصينية JEDEC مع خوارزمية AI الديناميكية ودعم السحابة
Unicomp SMD Chip Counter X Ray quad reel and JEDEC tray with dynamic AI algorithm and Cloud support Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
SMT BGA X Ray Detection Equipment Flip Chip FPD Detector 130KV For Semicon
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image
في نظام فحص الأمتعة في نظام Linex Ray ، نظام التحكم في الحركة CNC لإضاءة LED
In-line X-Ray Inspection Machine for LED Lighting Unicomp Technology upholds its Integrity, Deploitation and Excellence in the business, is committed to meeting the highest level of International Standards and promises to be a responsive partner with all of our customers. This philosophy has enabled Unicomp to generated a strong Global customer base of many International Renowned companies including Flextronics, Foxconn, Samsung, Philips, GM, Bosch, Emerson, Delphi,ABB, BYD,
آلة فحص FPD 130kV X Ray لسخان الخرطوشة
Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point
التفتيش SMT بغا X راي رقاقة عداد 440mm نفق CE
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
X Ray SMD Chip Counter CX7000L 1.1kW مع تكامل قاعدة بيانات مستودع ERP MES
Unicomp CX7000L X-ray for SMD Chip Counter with ERP MES warehouse database integration Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows
أشباه الموصلات X راي رقاقة عداد 440 مم نفق CX7000L لحزمة أنبوب بكرة رباعية
China factory supply of SMD component counter X-ray CX7000L for quad reel, JEDEC Tray, Tube package Main Configuration 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1 kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System
إمالة BGA لحام مشترك إلكترونيات آلة التفتيش بالأشعة السينية AX8300MAX Unicomp تحليل الفراغ التلقائي
Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional
