bga x ray machine
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90KV 5um microfocus مغلق الأنبوب نظام فحص الأشعة السينية مع دقة عالية FPD ل PCBA لحام فراغ العيوب checki
90KV 5um microfocus closed tube X-ray Inspection System with high resolution FPD for PCBA soldering void Defects checki Application Fields of X-ray machine Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of X-ray machie 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD
SMT Chipset Resistance جهاز الفحص الإلكتروني AX8200 X-Ray مغلق 5g
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
<7μm التركيز الجزئي 41X التكبير IC مكون أشباه الموصلات معدات الأشعة السينية AX9100 Unicomp CNC الفحص التلقائي
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 130KV 7μm X-Ray Sealed tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
كشف الفراغ التلقائي عالي الدقة للحركة BGA معدات الأشعة السينية المشتركة AX8300 Unicomp مراقبة الجودة
Unicomp X-ray Detector AX8300 The AX-8300 is professionally engineered to satisfy high-precision visual inspection requirements for PCBA assemblies.It pioneers the adoption of a customized 110kV micro-focus X-ray source within the industry, acting as an optimal intermediate-grade solution. It delivers balanced penetrating capability, effectively compensating for the insufficient energy of 90kV equipment while avoiding the excessive radiation power of 130kV models.Featuring a
5μm 110kV أنبوب مختوم IC أشباه الموصلات إلكترونيات آلة التفتيش بالأشعة السينية AX8300 Unicomp عالية الدقة
5μm 110kV Sealed Tube IC Semiconductor Electronics Xray Inspection Machine AX8300 Unicomp High Precision AX8300 is purpose-built to fulfill high-precision inspection needs for PCBA manufacturing. It features an innovative 110kV micro-focus X-ray source, uniquely developed to bridge the performance gap between standard 90kV and 130kV systems. It delivers balanced penetration power, perfectly suited for scenarios where 90kV is insufficient and 130kV is overly powerful. Powered
نظام التحليل بالأشعة السينية Unicomp AX9100vs متعدد الأوضاع 3D Micro-focus
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
Unicomp AX8300VS نظام تفتيش متعدد الأوضاع 3D ميكرو تركيز الأشعة السينية
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
أجهزة الفحص بالأشعة السينية لشركة Unicomp AX8300 Plus
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
360 درجة دوران CNC التلقائي MOSFET PCB الجمعية نظام التفتيش بالأشعة السينية AX8300MAX Unicomp أداء مستقر
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,
