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جودة نظام فحص BGA QFN Unicomp X Ray 130KV مع حركة 6 محاور مصنع

نظام فحص BGA QFN Unicomp X Ray 130KV مع حركة 6 محاور

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

جودة نظام الفحص المضمن Unicomp LX9200 X Ray عالي الدقة لتحليل PCB / BGA مصنع

نظام الفحص المضمن Unicomp LX9200 X Ray عالي الدقة لتحليل PCB / BGA

Inline High-Precision 3D X-Ray Tomography for PCB and BGA Analysis Unicomp LX9200 X-Ray inspection system Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge... Semiconduc

جودة Unicomp LX9200 3D CT X Ray آلة التصوير المقطعي المحوسبة 130KV مضمن لفحص PCB BGA مصنع

Unicomp LX9200 3D CT X Ray آلة التصوير المقطعي المحوسبة 130KV مضمن لفحص PCB BGA

Unicomp high quality 130KV inline Unicomp LX9200 3D CT X-Ray computed temography machine for PCB BGA inspection Unicomp Technology 3D Inline X-ray Inspection Equipment——LX9200 As a new generation of upgraded and optimized LX9200 online inspection equipment, it can easily meet the multi-directional and multi-angle product inspection needs of different users. Application Field SMT/PCBA Package type: BGA, LGA, CSP, POP, SIP... Defect type: Void, HIP, Insufficient, Bridge...

جودة آلة فحص الأشعة السينية للوحات الورقية المختومة AX8200max ذات الأداء العالي مصنع

آلة فحص الأشعة السينية للوحات الورقية المختومة AX8200max ذات الأداء العالي

90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector

جودة فحص جودة لحام Unicomp AX8500 110kV 5um 2.5D للإلكترونيات SMT PCBA BGA IC مصنع

فحص جودة لحام Unicomp AX8500 110kV 5um 2.5D للإلكترونيات SMT PCBA BGA IC

Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)

جودة 5 ميكرومتر Microfocus X-ray مع عرض مائل FPD 55 درجة لفحص فراغ لحام PCBA BGA QFN LED مصنع

5 ميكرومتر Microfocus X-ray مع عرض مائل FPD 55 درجة لفحص فراغ لحام PCBA BGA QFN LED

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel

جودة Microfocus أنبوب مغلق Unicomp X Ray 130kV 3um لحام SMT BGA مصنع

Microfocus أنبوب مغلق Unicomp X Ray 130kV 3um لحام SMT BGA

CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnificati

جودة عالية الدقة UNICOMP X Ray CT آلة AX9500 لفحص PCB / BGA دقيق مصنع

عالية الدقة UNICOMP X Ray CT آلة AX9500 لفحص PCB / BGA دقيق

High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT) Applications Widely Used in semiconductor, SMT, photovoltaic, ceramic products and other special industries, can also be used to detect auto parts, aluminum

جودة AX8200max نظام الأشعة السينية لـ Unicomp للتحقق من العيوب الداخلية للمكونات الإلكترونية مصنع

AX8200max نظام الأشعة السينية لـ Unicomp للتحقق من العيوب الداخلية للمكونات الإلكترونية

90kV maintanence free closed tube SMT X-Ray machine Unicomp AX8200MAX for BGA LED soldering voids measurement Specification Of SMT X-Ray machine Unicomp AX8200MAX System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector