bga x ray inspection system
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نظام فحص الأشعة السينية FPD 90KV معتمد من قبل CE / FDA للكشف عن عيوب المكثفات
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
آلة فحص سطح المكتب بالأشعة السينية BGA 0.5kW CX3000 CSP SMT للطب
Desktop CX3000 X-ray inspection machine for medical disposable venous needle installation failure analysis OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after
BGA CSP 0.5kW إلكترونيات X راي 100kV X راي معدات التفتيش
X-ray inspection for Electric Cable Wire Inner Quality Check for broken and twrist defect OUR SERVICE 1. Your inquiry will be replied in 12 hours. 2. Original Manufacture to customers, with competitive price. 3. We provide one year warranty, free training and whole life technology support. 4. We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5. Well-trained and Professional after-sales service team
آلة الفحص بالأشعة السينية Unicomp AX8300H مع مصدر الأشعة السينية المجهر بقوة 110kV و FPD عالي الدقة
فحص بالأشعة السينية AX8300H مع مصدر تركيز دقيق 110 كيلو فولت ودوران 360 درجة. كشف FPD عالي الدقة لتحليل BGA وCSP وأشباه الموصلات. يفي بمعايير السلامة لدى إدارة الغذاء والدواء الأمريكية (FDA) مع تسرب أقل من 1μSv/h.
IC صورة عالية الدقة Unicomp Weld X راي آلة التفتيش Microfocus
Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
عالية الطاقة بب X راي التفتيش المعدات
Online inspection system PCB X Ray Machine with high power x-ray sources Item Definition Specs System Parameters Size 1385(L)x1400(W)x1620(H)mm Weight 2000kg Power 220AC/50Hz Power Consumption 3.5kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 3μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 200 X Detection Region Orbit Adjusting Range 80-350mm X-ray Leakage
شاشة LCD 1.0kW X راي التفتيش آلة Unicomp AX8200 BGA التفتيش
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
آلة التفتيش Unicomp AX8200max X Ray لفحص عيوب تسخير الأسلاك
Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Technical Specifications of BGA Xray machine AX8200max System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC
جهاز المسح الضوئي بالأشعة السينية Unicomp AX8200 100KV X لـ BGA CSP
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
