bga x ray inspection system
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أنبوب مغلق SMT X Ray معدات AX8200 8W لوحدات إلكترونيات السيارات
Applying 5micro closed tube AX8200 X-ray for Automotive Electronics Modules quality defects control Other Special Industries. Item Definition Specs System Parameters Size 1080(L)X1180(W)X1730(H)mm Weight 1150kg Power 220AC/50HZ Power Consumption 0.8KW X-Ray Tube Type Closed Max.Voltage 90kv/100kv Max.Power 8W Spot Size 5μm X-Ray System Intensifier 4"Image Intensifier Monitor 22"LCD System Magnification 600X Detection Region Max.Loading Size 510mm x 420mm Max.Inspection Area
التفتيش SMT بغا X راي رقاقة عداد 440mm نفق CE
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Unicomp AX8200max FPD كاشف X آلة راي لـ EMS SMT PCBA QFP
CHINA Leading X-ray manufacturer Unicomp AX8200max machine for EMS SMT PCBA QFP IC SOT package reflow Soldering Void Inspection Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3
5um عالية الدقة 90KV Unicomp X راي FPD كاشف لتسخير الأسلاك
Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features 1.Large Size Inspection Table Laser Locator for Precise Location 2.24’’ FHD Interactive Touch LCD Display 3.Accurate Control, CNC Programming Automatic Positioning 4.FPD 60° Tilting Inspection 5.Fingerprint Access Management System 6
لوحات إلكترونية عالية المواصفات 2D و 2.5D آلة الأشعة السينية Unicomp AX9100MAX مع طاولة دوران 360 درجة للفحص BGA و PCB
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
كاشف FPD 1kW 90KV EMS التفتيش X راي المعدات
Application BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB Semiconductor , Battery Industry , Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry Features • 90kV 5µm closed X-ray tube, digital flat panel with 2 mega pixels CCD camera • Multi-function DXI image processing system, CNC programmable detection • Max. loading area 500mm*450mm, max. inspection area 500mm*450mm, with 600X Magnification • Multi-function workstation with
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp X-ray AX9100max Functions and Features Functions and features of Unicomp X-ray AX9100max Inspection Image Sample inspection image from Unicomp X-ray AX9100max Technical Parameters and
جهاز الأشعة السينية AX7900 غير المتصل من Unicomp مع رسم الخرائط التلقائي وقياس اللحام التلقائي BGA QFN LED
Unicomp offline AX7900 X-ray machine with auto-mapping and BGA QFN LED soldering Void auto measurement Specifications of Unicomp offline AX7900 X-ray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat
نظام أشعة X-ray AX7900 من Unicomp مع عرض مائل FPD لفحص كوابل SMT EMS BGA IC والأسلاك
Unicomp close tube AX7900 X-ray system with FPD tilting view for SMT EMS BGA IC Cable & wires qualtiy inspection Specifications of AX7900 X-ray system: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel
